How Does F4BM220 PCB Compare to F4BME220?
How Does F4BM220 PCB Compare to F4BME220?
Discover the exceptional qualities of F4BM220 PCB, a cutting-edge laminate engineered to enhance electrical performance, insulation resistance, and stability. Learn about its features, construction details, and diverse applications.And compare F4BM220 and F4BME220.
Introduction
Wangling F4BM220 laminates revolutionize the world of PCBs by integrating a meticulous combination of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and polytetrafluoroethylene film. Boasting superior electrical performance compared to F4B220, the F4BM220 offers reduced dielectric loss, heightened insulation resistance, and improved stability. This high-quality laminate presents an excellent alternative to comparable foreign products.
Introduction of F4BM220
Wangling's F4BM220 F4B substrate offers remarkable advantages through its unique composition. By scientifically formulating and precisely pressing fiberglass cloth, PTFE resin, and PTFE film, this laminate facilitates precise control over the dielectric constant. In turn, it delivers low loss, enhanced dimensional stability, and exceptional performance. Furthermore, F4BM220 is designed to replace similar foreign products, championing reliability and innovation.
Features of F4BM220
The F4BM220 material PCBexhibits an impressive set of features that make it a top choice for advanced applications:
1. Dielectric constant (Dk) of 2.2 at 10GHz ensures optimal signal integrity.
2. Dissipation factor of 0.001 at 10GHz contributes to minimal signal loss.
3. Coefficient of Thermal Expansion (CTE) x-axis of 25 ppm/°C, CTE y-axis of 34 ppm/°C, CTE z-axis of 240 ppm/°C, -55°C to 288°C delivers exceptional dimensional stability across a wide temperature range.
4. Low thermal coefficient of Dk at -142 ppm/°C, -55°C to 150°C ensures consistent performance under varying thermal conditions.
5. Moisture absorption of≤0.08% guarantees reliable operation in humid environments.
6. Flammability rating of UL-94 V0 provides enhanced safety and protection.
How does F4BM220 PCB compare to F4BME220?
F4BM220 PCB and F4BME220 PCB are two variants of laminates with slight differences in their copper foil combinations. Here's a comparison between the two:
- Dielectric Layer:F4BM220 and F4BME220 share the same dielectric layer material, which consists of a combination of fiberglass cloth and polytetrafluoroethylene (PTFE) resin.
- Copper Foil Combination: The main difference lies in the copper foil used in each laminate. F4BM220 is paired with ED (Electro-Deposited) copper foil, whereas F4BME220 is paired with reverse-treated foil (RTF) copper foil.
- PIM Performance:F4BM220, with its ED copper foil, is suitable for applications without PIM (Passive Intermodulation) requirements. On the other hand, F4BME220, with RTF copper foil, offers excellent PIM performance. This makes F4BME220 a preferable choice when precise line control, lower conductor loss, and superior PIM performance are needed.
- Electrical Performance:While both laminates offer improved electrical performance compared to F4B220, F4BM220 exhibits lower dielectric loss, increased insulation resistance, and improved stability. The precise control of the dielectric constant achieved by adjusting the ratio between PTFE and fiberglass cloth in F4BM220 leads to lower loss and enhanced dimensional stability.
In summary, F4BM220 and F4BME220 share the same dielectric layer, but F4BM220 is paired with ED copper foil for applications without PIM requirements, whereas F4BME220 is paired with RTF copper foil to provide excellent PIM performance, precise line control, and lower conductor loss. The choice between the two depends on the specific requirements of the application hand.
F4BM220 PCB Stackup: 2-layer rigid PCB
The 1.0MM F4BM220 laminate shines in 2-layer rigid PCB applications. Its stackup consists of the following layers:
Copper_layer_1: 35μm
F4BM220 Core: 1.00 mm
Copper_layer_2: 35μm
F4BM220 PCB Construction Details
To ensure optimal functionality and performance, strict construction details are followed:
Board dimensions: 45mm x 62mm (±0.15mm) for each PCB.
Minimum Trace/Space: 4/7 mils, enabling intricate circuitry designs.
Minimum Hole Size: 0.3mm, ensuring precise component placement.
No Blind vias, simplifying the manufacturing process.
Finished board thickness: 1.1mm, striking a balance between durability and compactness.
Finished Cu weight: 1oz (1.4 mils) outer layers, offering sufficient conductivity.
Via plating thickness: 20μm, ensuring reliable interconnectivity.
Surface finish: Immersion tin, providing excellent solderability and corrosion resistance.
Bottom and TOP Silkscreen: None, simplifying the board's aesthetics.
Top Solder Mask: Black, safeguarding against solder bridging and moisture.
Bottom Solder Mask: None, optimizing production efficiency.
100% Electrical test used prior to shipment, ensuring functional integrity.
PCB Statistics
The F4B DK2.2 PCB boasts the following statistics:
Components: 10, allowing for versatile circuit designs.
Total Pads: 34, accommodating diverse connections.
Thru Hole Pads: 19, enabling through-hole component soldering.
Top SMT Pads: 15, facilitating surface mount technology (SMT) applications.
Bottom SMT Pads: 0, offering flexibility for specific designs.
Vias: 23, ensuring efficient signal routing.
Nets: 2, enabling well-organized circuit connections.
Artwork Supplied: Gerber RS-274-X
The artwork for F4BM220 PCB is supplied in Gerber RS-274-X format, a widely used file standard for PCB fabrication and assembly. This format ensures compatibility and ease of use across the industry.
Quality Standard: IPC-Class-2
Maintaining high-quality standards, F4BM220 PCB adheres to the IPC-Class-2 quality standard. This ensures precise manufacturing and reliability, meeting the demanding requirements of advanced applications.
Availability: Worldwide
Wangling's F4BM220 PCB is readily available across the globe, allowing customers to leverage its remarkable features and benefits no matter their geographic location. With a commitment to consistent supply and prompt delivery, Wangling stands as a trusted partner for your PCB needs.
Some Typical Applications
F4BM220 PCB finds extensive application in various cutting-edge technologies, including:
Microwave, RF, and radar systems:
Ensuring reliable signal transmission and reception.
Phase shifters:
Facilitating the manipulation of signal phase and accuracy.
Power dividers, couplers, and combiners:
Enabling efficient power distribution in complex systems.
Feed networks:
Supporting the essential functions of distributing signals in antenna arrays.
Phase-sensitive antennas and phased array antennas:
Delivering precision and control in beamforming.
Satellite communications:
Ensuring seamless and efficient connectivity in space-based systems.
Base station antennas:
Contributing to reliable wireless communication networks.
Conclusion
In conclusion, the F4BM220 high frequency PCB from Wangling stands as an exceptional choice for advanced applications, providing enhanced electrical performance, superior insulation resistance, and improved stability. With its impressive features, precise construction details, and worldwide availability, this high-quality laminate serves as a reliable foundation for cutting-edge technologies across diverse industries. Partner with Wangling and unlock the potential of the F4BM220 Wangling PCB for your next-generation projects.